BSI-K-TR-0155-2013
NXP ePassport Inlay
with operating System TCOS 2.1
Release 1 on chip P60D144P VA
Smartcard with secure contactless chip
| Antragsteller | NXP Semiconductors Germany GmbH |
| Prüfstelle / Auditor |
secunet Security Networks AG
CETECOM ICT Services GmbH |
| Technische Richtlinie | BSI TR-03105 – Conformity Tests for Official Electronic ID Documents |
| Prüfbereich/e |
BSI TR-03105 – Chip Tests on Layer 6, 7 BSI TR-03105 – Chip Tests on Layer 1-4 |
| Prüfgrundlage/n |
BSI TR-03105, Teil 2, Version 2.2 |
| Ausstellungsdatum | 05.08.2013 |