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BSI-K-TR-0133-2012

NXP eID Inlay

with operating System TCOS ID 1.1
Release 1 on chip P60D144P VA

Smartcard with secure contactless chip

Antragsteller NXP Semiconductors Germany GmbH
Prüfstelle / Auditor secunet Security Networks AG
CETECOM ICT Services GmbH
Technische Richtlinie BSI TR-03105Conformity Tests for Official Electronic ID Documents
Prüfbereich/e BSI TR-03105 – Chip Tests on Layer 6, 7
BSI TR-03105 – Chip Tests on Layer 1-4
Prüfgrundlage/n

BSI TR-03105, Teil 2, Version 2.2
BSI TR-03105, Teil 3.3, Version 1.0.3
BSI TR-03105, Teil 3.4, Version 1.0

Ausstellungsdatum 12.12.2012