BSI-DSZ-CC-S-0242-2023
SFA Semicon Co. Ltd. Bumping Factory, 30, 2gongdan 7-gil, Seobuk-gu, Cheonan-si, Chungcheongnam-do, Korea
| Antragsteller / Applicant | SFA Semicon Co. Ltd. 30, 2gongdan 7-gil, Seobuk-gu, Cheonan-si |
| Prüfstelle / Evaluation Facility |
TÜV Informationstechnik GmbH |
| Standorttyp / Type of Site |
Smart Card Production Site |
| Prüftiefe / Assurance |
ALC_CMC.5, ALC_CMS.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_TAT.3 |
| Ausstellungsdatum / Certification Date |
10.11.2023 |
| gültig bis / valid until |
23.09.2025 |
Zertifizierungsreport / Certification Report
Standortsicherheitsvorgaben / Site Security Target
SFA Semicon Co. Ltd. Bumping Factory bietet den Service Wafer Bumping für Sicherheitschips.
SFA Semicon Co. Ltd. Bumping Factory provides services for wafer bumping for security ICs.